Abstract: Over the past 20 years, we have developed arrays of custom-fabricated silicon and InP Geiger-mode avalanche photodiode arrays, CMOS readout circuits to digitally count or time stamp ...
Abstract: Through-silicon via (TSV) is one of the key enabling technologies of stacked 3D ICs. However, the crosstalk among the adjacent TSVs decreases the performance of TSV bus and deteriorates the ...
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